Apple chip maker TSMC planning bond sale to fund Arizona expansion

Apple Silicon maker TSMC plans to raise over half a billion dollars in bonds as it attempts to expand its operations to Arizona while facing a worldwide chip shortage.

TSMC plans on using a bond sale to fund expansion, including an Arizona plantTSMC plans on using a bond sale to fund expansion, including an Arizona plant

Taiwan Semiconductor Manufacturing Co. (TSMC) reportedly plans on offering around NT$16 billion (US$565.25 million) of bonds in the auction. The chipmaker will face a global rate hike, as many corporate bond yields have recently risen from record lows.

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